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The $3Bn printed electronics industry is expected to grow to $45Bn by 2021 and over $300Bn by 2027 (IDTechEx), with over one-third of the market being logic & memory. Printed and flexible logic will need to progress from the simple functionality currently possible commercially (fewer than 100 transistors/circuit) to more complex capabilities (>1,000 transistors/circuit). It will be essential that these printed circuits are produced at very low cost such that they become ubiquitous within consumer products, novelties, toys and security labels, in addition to higher-end uses such as military and defence. Optimised designs will allow efficient circuits to be fabricated, impacting directly on cost. However, printed and flexible TOLAE (thin, organic and large area electronics) circuit design is still limited due to the very small number of designers, usually only linked to technology providers, and the lack of available complete compact device models to carry out accurate designs of TOLAE circuits. The design community at large need a user-friendly integration of high performance OTFT and oxide based semiconductor TFT compact models into industry standard Electronic Design Automation (EDA) circuit design tools to reduce design cycle duration. Our project aims to fill the gap between printed and flexible TOLAE technology and design by developing highly predictive, generic, open-source, design-oriented organic and oxide based TFT compact model libraries, to be integrated in commercial Electron Design Automation (EDA) environments for full large area low cost circuit design for novel printed and flexible applications. These model libraries will be released together with parameter extraction standard templates to assist in the fast transfer between initial prototype device measurements to full product design. Such a facility will open the opportunity for wide flexible electronics design.


Working Groups

WG1: Physical Modelling
Partners: URV, Silvaco, THM, CEA-LITEN, TNO, XTEC, UCAM, AdMOS

WG2: Compact Modelling
Partners: URV, XTEC, THM, SIlvaco, AdMOS, UCAM, Infiniscale, CEA-LITEN, TNO

WG3: Model Integration
Partners:Silvaco, Infiniscale, AdMOS, URV, XTEC, UCAM, THM, CEA-LITEN, TNO

Main Achievements
Training Courses
SINANO Summer School